| Dokumendiregister | Majandus- ja Kommunikatsiooniministeerium |
| Viit | 6-4/2381-1 |
| Registreeritud | 07.07.2026 |
| Sünkroonitud | 08.07.2026 |
| Liik | Sissetulev kiri |
| Funktsioon | 6 Rahvusvahelise koostöö korraldamine |
| Sari | 6-4 Tervitus- ja tutvustuskirjad, kutsed üritustel osalemiseks |
| Toimik | 6-4/2026 |
| Juurdepääsupiirang | Avalik |
| Adressaat | Taipei Mission in the Republic of Latvia |
| Saabumis/saatmisviis | Taipei Mission in the Republic of Latvia |
| Vastutaja | Kairi Otto (Majandus- ja Kommunikatsiooniministeerium, Kantsleri valdkond, Majanduse ja innovatsiooni valdkond, Innovatsiooni ja tehnoloogia osakond) |
| Originaal | Ava uues aknas |
| Taotle dokumendi eemaldamist või parandamist |
TAIPEI MISSION IN THE REPUBLIC OF LATVIA
14-2 Ausekia Street Phone: (371) 67321166 Riga LV-1010 Fax: (371) 67830135 Latvia E-mail: [email protected]
TMIL/RG-007 1
June 25, 2026 Honorable Erkki Keido Minister
Ministry of Economy and Industry Republic of Estoiiia
Dear Hon. Minister,
It is my pleasure to inform you that the “Workshop on Semiconductor Supply Chain
Development,” organized by the Taiwan International Cooperation and Developrnent
Fund (TaiwanICDF), is scheduled to be held from September 1 to 10, 2026. On behalf
of the Taipei Mission in the Republic of Latvia, 1 cordially invite your esteerned
Ministry to norninate a senior official to participate in this exclusive program.
The objectives of the workshop are as follows: (1) to gain a cornprehensive
understanding of Taiwan’s semiconductor industry development path; (2) to learn how
Taiwan has built a comprehensive and resilient semiconductor supply chain; and (3) to
share Taiwan’s experience in cultivating advanced technical talent. In addition, the
workshop features exclusive field visits, and the participants have opportunity to visit
prernier IC design cornpanies, wafer fabrication facilities, packaging and testing plants,
and advanced training centers, as well as engage directly with leading industry
professi onal s.
For qualified and selected participants, TaiwanICDF will cover the costs of econorny
class round-trip airfare, course fees, meals and accommodation. Participants wiII be
responsible for their own personal or incidental expenses. Enclosed please find an
introduction to the workshop for your reference. To secure a seat, nominated
application must be submitted through this Mission no later than July 30, 2026.
Should you have aiiy questions, please feel free to have your colleagues contact Mr.
Eugene Wu at +371 2800 9952 or via ernail at hxwumofa.gov.tw. Alternatively, they
rnay coiitact this Mission at +371 6732 0610 or via email at 1vamofa.gov.tw.
1 avail rnyself of this opportunity to renew to you, Hon. Minister, the assurances of my
highest consideration.
Sincerely yours
Winston Wen-yi Chen
Representative
Encl: als
Cc.:
1 Mr. Mati Murd, Director, Asia and the Pacific Region, Ministry of Foreign
Affairs, Republic ofEstonia
2 Mr. Mait Palts, Director General, Estonian Chamber of Cornmerce and Industry
(ECCI), Republic of Estonia
3 Ms. Jana Si1akova, Head of Internationalization, Estonian Association of
Information Technology and Telecommunications, Republic of Estonia
Overview Taiwan hosts the wortd’s most comptete semiconductor c[uster, with wafer
foundry output ranking first gLobaL[y. As a key driver of innovation, the
industry is capita[- and techno(ogy-intensive, demanding advanced
equipment and [ong-term investment.
n Line with the DipLomatic ALlies Prosperity Project, this workshop shares
Taiwan’s experience in buitding a resiLient semiconductor ecosystem
through effective po[icies and industry-academia co[Laboration.
Objectives
O Understand Taiwan’s semiconductor development path.
O Learn how Taiwan buiLt a comp[ete and resitient supply chain.
O Share Taiwan’s experience in cuLtivating advanced technica[ tatent.
8 Workshop on Semiconductor Supply Chain Development Date 1- 10 September, 2026
Application Deadiine 3 August, 2026
*Invitation required: Through the R.O.C. (Taiwan) embassies, representative offices or Taiwan technicat missions.
Content
O Semiconductor DeveLopment and Trends: Overvew of wafer
fabrication, packaging/testing, and emerging fields such as Al and
automotive chips, highLighting key technoLogies and market trends.
O Government and Academia Roles: How poLicies, R&D programs,
and science parks promote innovation and talent cuLtivation
through industry-academia collaboration
Supply Chain Resilience Efforts to enhance key materiat supply,
advanced processes, and green energy use through poLicy and
innovation.
O IndustriaL Layout: Functions of major science parks—Hsinchu,
CentraL, and Southern Taiwan—in buitding a resiLient cluster
ecosystem.
O Field Visits: Visits to IC design, wafer fabs, packaging/testing
pLants, and training centers with industry exchanges.
Who May Apply
O Background: Otficia[s from economic and industria[ ministries, and
representatives from etectrica[, e[ectronics, and semiconductor
re[ated associations and enterprises.
O Expertise: Industrial deveLopment, techno(ogcaL innovation, and
suppty chain management.
/rjZ iTT) mi
Tel: 886-2-28886090
E-maiI: Ly.hsu©icdf.org.tw